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High entropy alloy product details:
| main products | High entropy alloy | |||
| Main grain size range | 0-25 μm | 15-53 μm | 45-105 μm | 75-150 μm |
| mobility | 15-53μm | ≤30s/50g | ||
| Bulk density | ≥50% of parent alloy | |||
| oxygen content | ≤300ppm | |||
| nitrogen content | ≤300ppm | |||
High entropy alloy powder can be used in laser/electron beam additive manufacturing (SLM/EBM), injection molding (MIM), hot isostatic pressing (HIP), powder metallurgy (PM), spraying (SP) and other processes.
